Philips Stereo Amplifier TDA2549 User Manual

INTEGRATED CIRCUITS  
DATA SHEET  
TDA2549  
I.F. amplifier and demodulator for  
multistandard TV receivers  
April 1985  
Product specification  
File under Integrated Circuits, IC02  
 
Philips Semiconductors  
Product specification  
I.F. amplifier and demodulator for  
multistandard TV receivers  
TDA2549  
Fig.1 Block diagram.  
April 1985  
3
 
Philips Semiconductors  
Product specification  
I.F. amplifier and demodulator for  
multistandard TV receivers  
TDA2549  
RATINGS  
Limiting values in accordance with the Absolute Maximum System (IEC 134)  
Supply voltage (pins 13 and 21)  
Storage temperature range  
VP  
13,8  
V
Tstg  
Tamb  
25 to +125  
25 to +70  
°C  
°C  
Operating ambient temperature range  
CHARACTERISTICS (measured in fig.5)  
VP = 12 V; Tamb = 25 °C  
PARAMETER  
SYMBOL  
MIN.  
TYP.  
MAX.  
13,2  
UNIT  
Supply voltage range  
VP  
IP  
10,8  
12  
82  
V
Supply current (pins 13 and 21)  
I.F. input signal for Vo = 2 V  
(between pins 6 and 7)  
mA  
Vi = V6-7  
50  
2
150  
µV  
kΩ  
pF  
Input impedance (differential)  
Input capacitance (differential)  
Zero single output level  
|Z6-7  
|
C6-7  
2
positive modulation  
V22-3  
V22-3  
V22-3  
Gv  
1,6  
3,7  
1,7  
50  
2
2,3  
4,3  
2,3  
V
negative modulation  
4
V
Top sync output level  
2
V
Gain control range  
74  
57  
dB  
dB  
Signal-to-noise ratio at Vi = 10 mV (note 1)  
Maximum video output amplitude for positive  
modulation (peak-to-peak value)  
Bandwidth of video amplifier (3 dB)  
Differential gain at Vo = 2V  
Differential phase at Vo = 2 V  
Residual carrier signal (r.m.s. value)  
Residual second harmonic of carrier signal  
(r.m.s. value)  
S/N  
50  
V22-3(p-p)  
B
4,5  
5,5  
4
10  
10  
20  
V
MHz  
%
dG  
dϕ  
V24-3(rms)  
2
%
10  
mV  
V24-3(rms)  
20  
60  
mV  
April 1985  
4
 
Philips Semiconductors  
Product specification  
I.F. amplifier and demodulator for  
multistandard TV receivers  
TDA2549  
PARAMETER  
SYMBOL  
V15-3  
MIN.  
TYP.  
MAX.  
UNIT  
A.F.C. output voltage swing  
Change of frequency required for a.f.c.  
output voltage swing of 10 V  
A.F.C. switch off for a voltage lower than:  
A.F.C. inverter switch  
10  
V
f  
V17-3  
70  
200  
1,5  
kHz  
V
positive a.f.c. (Fig.2)  
V16-3  
V16-3  
0
4
1,5  
12  
V
V
negative a.f.c. (Fig.3)  
Tuner A.G.C.  
Leakage current  
I10  
15  
µA  
Saturation voltage  
I
10 = 0,3 mA  
V10-3  
Vi  
10  
0,1  
0,3  
3
V
take-over point LOW  
take-over point HIGH  
mV  
mV  
dB  
Vi  
0,5  
Signal expansion at Gv = 50 dB  
Negative modulation (Fig.4)  
white spot inverter threshold level  
white spot insertion level  
noise inverter threshold level  
noise insertion level  
V22-3  
V22-3  
V22-3  
V22-3  
V22-3  
4,6  
3,2  
0,9  
2,5  
V
V
V
V
Positive modulation a.g.c. detector  
reference level  
V11-3  
V12-3  
3,0  
0,7  
3,2  
1
3,4  
1,4  
V
V
Auxiliary video input signal for Vo(p-p) = 2 V  
Auxiliary video output  
output signal (note 2)  
V14-3  
V14-3  
1
1
2
7
3
V
V
top sync level  
output impedance  
|Z14-3  
|
Levels for video switches  
positive video  
V2-3  
3
1
V
V
V
V
negative video  
V2-3  
1
internally demodulated signal  
auxiliary video signal  
V23-3  
V23-3  
3
Notes to the characteristics  
Vo black-to-white  
1. Signal to noise ratio S/N =  
----------------------------------------------------------  
Vn (rms) at B= 5 MHz  
2. Measured in application of Fig. 5.  
April 1985  
5
 
Philips Semiconductors  
Product specification  
I.F. amplifier and demodulator for  
multistandard TV receivers  
TDA2549  
Fig.2 A.F.C. output voltage V15-3 for positive a.f.c.  
Fig.3 A.F.C. output voltage V15-3 for negative a.f.c.  
Fig.4 Video output waveform showing white spot and noise inverter threshold levels.  
April 1985  
6
 
Philips Semiconductors  
Product specification  
I.F. amplifier and demodulator for  
multistandard TV receivers  
TDA2549  
APPLICATION INFORMATION  
Fig.5 Application diagram.  
April 1985  
7
 
Philips Semiconductors  
Product specification  
I.F. amplifier and demodulator for  
multistandard TV receivers  
TDA2549  
PACKAGE OUTLINE  
DIP24: plastic dual in-line package; 24 leads (600 mil)  
SOT101-1  
D
M
E
A
2
A
L
A
1
c
e
w M  
Z
b
1
(e )  
1
b
M
H
24  
13  
pin 1 index  
E
1
12  
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
(1)  
Z
A
A
A
(1)  
(1)  
1
2
UNIT  
mm  
b
b
c
D
E
e
e
L
M
M
H
w
1
1
E
max.  
min.  
max.  
max.  
1.7  
1.3  
0.53  
0.38  
0.32  
0.23  
32.0  
31.4  
14.1  
13.7  
3.9  
3.4  
15.80  
15.24  
17.15  
15.90  
5.1  
0.51  
4.0  
2.54  
0.10  
15.24  
0.60  
0.25  
0.01  
2.2  
0.066  
0.051  
0.021  
0.015  
0.013  
0.009  
1.26  
1.24  
0.56  
0.54  
0.15  
0.13  
0.62  
0.60  
0.68  
0.63  
inches  
0.20  
0.020  
0.16  
0.087  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
92-11-17  
95-01-23  
SOT101-1  
051G02  
MO-015AD  
April 1985  
8
 
Philips Semiconductors  
Product specification  
I.F. amplifier and demodulator for  
multistandard TV receivers  
TDA2549  
SOLDERING  
Introduction  
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and  
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for  
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often  
used.  
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our  
“IC Package Databook” (order code 9398 652 90011).  
Soldering by dipping or by wave  
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the  
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.  
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the  
specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may  
be necessary immediately after soldering to keep the temperature within the permissible limit.  
Repairing soldered joints  
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more  
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to  
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
April 1985  
9
 

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