Philips Network Card TDA6800 User Manual

INTEGRATED CIRCUITS  
DATA SHEET  
TDA6800  
TDA6800T  
Video modulator circuit  
March 1986  
Product specification  
File under Integrated Circuits, IC02  
 
Philips Semiconductors  
Product specification  
TDA6800  
TDA6800T  
Video modulator circuit  
RATINGS  
Limiting values in accordance with the Absolute Maximum System (IEC 134)  
Supply voltage  
V54  
V84  
V6, 74  
Tstg  
max.  
max.  
max.  
max.  
max.  
7 V  
4 V  
Input voltage  
Output voltage  
9 V  
Storage temperature  
Junction temperature  
Operating ambient temperature range  
125 °C  
125 °C  
Tj  
Tamb  
25 to + 85 °C  
THERMAL RESISTANCE  
From junction to ambient in free air  
TDA6800T  
TDA6800  
Rth ja  
Rth ja  
260 K/W  
120 K/W  
Fig.1 Block diagram TDA6800 and TDA6800T.  
March 1986  
3
 
Philips Semiconductors  
Product specification  
TDA6800  
TDA6800T  
Video modulator circuit  
CHARACTERISTICS  
VP = 5 V; Tamb = 25 °C; measured in Fig.1; unless otherwise specified  
PARAMETER  
Supply voltage range  
SYMBOL  
V5-4  
MIN.  
TYP.  
MAX.  
UNIT  
4,5  
9
5,5  
13  
V
Supply current consumption  
Video input voltage  
Input impedance  
I5  
mA  
V
V8(p-p)  
R8  
1
30  
kΩ  
Voltage (d.c.) at video  
input (clamp voltage)  
Voltage (d.c.) at  
V8  
1,4  
V
sound input  
V1  
2,5  
13  
10  
10  
10  
V
Output voltage f = 50 MHz; RL = 75 Ω  
Output voltage f = 600 MHz; RL = 75 Ω  
Differential gain  
V6-7  
V6-7  
mV  
mV  
%
G
Differential phase  
Intermodulation  
φ
deg.  
(1,1 MHz) (note 1)  
Frequency shift  
80  
60  
100  
dB  
Vb = 5%, f = 600 MHz  
Frequency shift  
kHz  
kHz  
kHz  
kHz  
f
Vb = 5%, f = 800 MHz  
Frequency drift  
f
tbf  
25 to 40 °C  
Frequency drift  
f
100  
300  
15 to 55 °C  
f
Positive modulation  
(see Fig.3)  
Residual carrier voltage  
Cross modulation (note 2)  
Vr  
0,1  
2,5  
%
%
α
0,25  
Notes  
1. Input signal: d.c. 0,45 V (V8-4 = 1,85 V)  
4,4 MHz; input voltage (p-p) = 0,6 V  
5,5 MHz; input voltage (p-p) = 1,26 V  
measured with respect to picture carrier, at f = 600 MHz.  
2. Input signal: d.c. 1 V (V8-4 = 3,5 V)  
5,5 MHz AM modulated, fm = 100 kHz  
m = 0,8; input voltage (p-p) = 2,27 V (including modulation)  
measured with respect to the picture carrier, at f = 600 MHz.  
March 1986  
4
 
Philips Semiconductors  
Product specification  
TDA6800  
TDA6800T  
Video modulator circuit  
* Close to output transformer.  
Fig.2 Application for negative modulation.  
* Close to output transformer  
Fig.3 Application for positive modulation.  
5
March 1986  
 
Philips Semiconductors  
Product specification  
TDA6800  
TDA6800T  
Video modulator circuit  
* Close to output transformer.  
Fig.4 Application for general purpose modulation.  
March 1986  
6
 
Philips Semiconductors  
Product specification  
TDA6800  
TDA6800T  
Video modulator circuit  
PACKAGE OUTLINES  
DIP8: plastic dual in-line package; 8 leads (300 mil)  
SOT97-1  
D
M
E
A
2
A
A
1
L
c
w M  
Z
b
1
e
(e )  
1
M
H
b
b
2
8
5
pin 1 index  
E
1
4
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
(1)  
Z
A
A
A
(1)  
(1)  
1
2
w
UNIT  
mm  
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.  
min.  
max.  
max.  
1.73  
1.14  
0.53  
0.38  
1.07  
0.89  
0.36  
0.23  
9.8  
9.2  
6.48  
6.20  
3.60  
3.05  
8.25  
7.80  
10.0  
8.3  
4.2  
0.51  
3.2  
2.54  
0.10  
7.62  
0.30  
0.254  
0.01  
1.15  
0.068 0.021 0.042 0.014  
0.045 0.015 0.035 0.009  
0.39  
0.36  
0.26  
0.24  
0.14  
0.12  
0.32  
0.31  
0.39  
0.33  
inches  
0.17  
0.020  
0.13  
0.045  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
92-11-17  
95-02-04  
SOT97-1  
050G01  
MO-001AN  
March 1986  
7
 
Philips Semiconductors  
Product specification  
TDA6800  
TDA6800T  
Video modulator circuit  
SO8: plastic small outline package; 8 leads; body width 3.9 mm  
SOT96-1  
D
E
A
X
v
c
y
H
M
A
E
Z
5
8
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
4
e
w
M
detail X  
b
p
0
2.5  
5 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(2)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
0.25  
0.10  
1.45  
1.25  
0.49  
0.36  
0.25  
0.19  
5.0  
4.8  
4.0  
3.8  
6.2  
5.8  
1.0  
0.4  
0.7  
0.6  
0.7  
0.3  
mm  
1.27  
0.050  
1.05  
0.041  
1.75  
0.25  
0.01  
0.25  
0.01  
0.25  
0.1  
8o  
0o  
0.010 0.057  
0.004 0.049  
0.019 0.0100 0.20  
0.014 0.0075 0.19  
0.16  
0.15  
0.244  
0.228  
0.039 0.028  
0.016 0.024  
0.028  
0.012  
inches 0.069  
0.01 0.004  
Notes  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
95-02-04  
97-05-22  
SOT96-1  
076E03S  
MS-012AA  
March 1986  
8
 
Philips Semiconductors  
Product specification  
TDA6800  
TDA6800T  
Video modulator circuit  
method. Typical reflow temperatures range from  
215 to 250 °C.  
SOLDERING  
Introduction  
Preheating is necessary to dry the paste and evaporate  
the binding agent. Preheating duration: 45 minutes at  
45 °C.  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
WAVE SOLDERING  
Wave soldering techniques can be used for all SO  
packages if the following conditions are observed:  
A double-wave (a turbulent wave with high upward  
pressure followed by a smooth laminar wave) soldering  
technique should be used.  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “IC Package Databook” (order code 9398 652 90011).  
The longitudinal axis of the package footprint must be  
parallel to the solder flow.  
DIP  
The package footprint must incorporate solder thieves at  
the downstream end.  
SOLDERING BY DIPPING OR BY WAVE  
The maximum permissible temperature of the solder is  
260 °C; solder at this temperature must not be in contact  
with the joint for more than 5 seconds. The total contact  
time of successive solder waves must not exceed  
5 seconds.  
During placement and before soldering, the package must  
be fixed with a droplet of adhesive. The adhesive can be  
applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the  
adhesive is cured.  
The device may be mounted up to the seating plane, but  
the temperature of the plastic body must not exceed the  
specified maximum storage temperature (Tstg max). If the  
printed-circuit board has been pre-heated, forced cooling  
may be necessary immediately after soldering to keep the  
temperature within the permissible limit.  
Maximum permissible solder temperature is 260 °C, and  
maximum duration of package immersion in solder is  
10 seconds, if cooled to less than 150 °C within  
6 seconds. Typical dwell time is 4 seconds at 250 °C.  
A mildly-activated flux will eliminate the need for removal  
of corrosive residues in most applications.  
REPAIRING SOLDERED JOINTS  
REPAIRING SOLDERED JOINTS  
Apply a low voltage soldering iron (less than 24 V) to the  
lead(s) of the package, below the seating plane or not  
more than 2 mm above it. If the temperature of the  
soldering iron bit is less than 300 °C it may remain in  
contact for up to 10 seconds. If the bit temperature is  
between 300 and 400 °C, contact may be up to 5 seconds.  
Fix the component by first soldering two diagonally-  
opposite end leads. Use only a low voltage soldering iron  
(less than 24 V) applied to the flat part of the lead. Contact  
time must be limited to 10 seconds at up to 300 °C. When  
using a dedicated tool, all other leads can be soldered in  
one operation within 2 to 5 seconds between  
270 and 320 °C.  
SO  
REFLOW SOLDERING  
Reflow soldering techniques are suitable for all SO  
packages.  
Reflow soldering requires solder paste (a suspension of  
fine solder particles, flux and binding agent) to be applied  
to the printed-circuit board by screen printing, stencilling or  
pressure-syringe dispensing before package placement.  
Several techniques exist for reflowing; for example,  
thermal conduction by heated belt. Dwell times vary  
between 50 and 300 seconds depending on heating  
March 1986  
9
 
Philips Semiconductors  
Product specification  
TDA6800  
TDA6800T  
Video modulator circuit  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
March 1986  
10  
 

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