Philips Car Amplifier TDA8571J User Manual

INTEGRATED CIRCUITS  
DATA SHEET  
TDA8571J  
4 × 40 W BTL quad car radio power  
amplifier  
Product specification  
2002 Mar 05  
Supersedes data of 1998 Mar 13  
 
Philips Semiconductors  
Product specification  
4 × 40 W BTL quad car radio power  
amplifier  
TDA8571J  
BLOCK DIAGRAM  
V
V
V
V
MODE  
15  
P1  
1
P2  
8
P3  
16  
P4  
23  
10  
IN1  
+
2
4
OUT1+  
30 kΩ  
+
OUT1−  
V
ref  
11  
IN2  
+
7
OUT2+  
30 kΩ  
+
5
9
OUT2−  
12  
13  
SGND  
IN3  
V
TDA8571J  
30 kΩ  
DIAGNOSTIC  
DIAG  
+
17  
OUT3+  
+
19  
OUT3−  
V
ref  
14  
IN4  
+
22  
20  
OUT4+  
30 kΩ  
+
OUT4−  
3
6
18  
21  
MGM562  
PGND1 PGND2 PGND3 PGND4  
Fig.1 Block diagram.  
3
2002 Mar 05  
 
Philips Semiconductors  
Product specification  
4 × 40 W BTL quad car radio power  
amplifier  
TDA8571J  
PINNING  
SYMBOL  
VP1  
PIN  
DESCRIPTION  
supply voltage 1  
handbook, halfpage  
V
1
2
3
4
5
6
7
8
9
P1  
1
2
OUT1+  
PGND1  
OUT1−  
OUT2−  
PGND2  
OUT2+  
OUT1+  
PGND1  
OUT1−  
OUT2−  
PGND2  
OUT2+  
VP2  
output 1+  
3
power ground 1  
output 1−  
output 2−  
power ground 2  
output 2+  
4
5
6
7
8
supply voltage 2  
diagnostic output  
input 1  
V
P2  
VDIAG  
IN1  
9
V
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
DIAG  
IN2  
input 2  
IN1 10  
IN2 11  
SGND  
IN3  
signal ground  
input 3  
TDA8571J  
SGND 12  
IN3 13  
IN4  
input 4  
MODE  
VP3  
mode select switch input  
supply voltage 3  
output 3+  
IN4 14  
MODE 15  
OUT3+  
PGND3  
OUT3−  
OUT4−  
PGND4  
OUT4+  
VP4  
V
16  
power ground 3  
output 3−  
output 4−  
power ground 4  
output 4+  
P3  
OUT3+ 17  
PGND3 18  
OUT319  
OUT420  
PGND4 21  
OUT4+ 22  
supply voltage 4  
V
23  
P4  
MGM563  
Fig.2 Pin configuration.  
2002 Mar 05  
4
 
Philips Semiconductors  
Product specification  
4 × 40 W BTL quad car radio power  
amplifier  
TDA8571J  
FUNCTIONAL DESCRIPTION  
SHORT-CIRCUIT DIAGNOSTIC  
The TDA8571J contains four identical amplifiers which can  
be used for bridge applications. The gain of each amplifier  
is fixed at 34 dB.  
When a short-circuit occurs at one or more outputs to  
ground or to the supply voltage, the output stages are  
switched off until the short-circuit is removed and the  
device is switched on again, with a delay of approximately  
10 ms after removal of the short-circuit. During this  
short-circuit condition, pin VDIAG is continuously LOW.  
Mode select switch (pin MODE)  
Standby: low supply current (<100 µA)  
Mute: input signal suppressed  
When a short-circuit occurs across the load of one or more  
channels, the output stages are switched off during  
approximately 10 ms. After that time it is checked during  
approximately 50 µs to determine whether the short-circuit  
is still present. Due to this duty cycle of 50 µs/10 ms the  
average current consumption during this short-circuit  
condition is very low.  
Operating: normal on condition.  
Since this pin has a low input current (<80 µA), a low cost  
supply switch can be applied.  
To avoid switch-on plops, it is advised to keep the amplifier  
in the mute mode during 150 ms (charging of the input  
capacitors at pins IN1, IN2, IN3 and IN4. When switching  
from standby to mute, the slope should be at least 18 V/s.  
This can be realized by:  
During this short-circuit condition, pin VDIAG is LOW for  
10 ms and HIGH for 50 µs (see Fig.5). The protection  
circuits of all channels are coupled. This means that if a  
short-circuit condition occurs in one of the channels, all  
channels are switched off. Consequently, the power  
dissipation in any short-circuit condition is very low.  
Microprocessor control  
External timing circuit (see Fig.3).  
Diagnostic output (pin VDIAG  
)
TEMPERATURE PRE-WARNING  
DYNAMIC DISTORTION DETECTOR (DDD)  
When the virtual junction temperature Tvj reaches 145 °C,  
pin VDIAG goes LOW.  
At the onset of clipping of one or more output stages, the  
dynamic distortion detector becomes active and pin VDIAG  
goes LOW. This information can be used to drive a sound  
processor or DC volume control to attenuate the input  
signal and so limit the distortion. The output level of  
pin VDIAG is independent of the number of channels that  
are clipping (see Fig.4).  
OPEN-COLLECTOR OUTPUTS  
The diagnostic pin has an open-collector output, so more  
devices can be tied together. An external pull-up resistor is  
needed.  
MGG155  
handbook, halfpage  
V
o
+V  
P
handbook, halfpage  
0
10 kΩ  
MODE  
47 µF  
V
9
BZX79C/3.9V  
V
P
MGD959  
0
t
Fig.3 Mode select switch circuitry.  
Fig.4 Distortion detector waveform.  
2002 Mar 05  
5
 
Philips Semiconductors  
Product specification  
4 × 40 W BTL quad car radio power  
amplifier  
TDA8571J  
short  
circuit  
MGG156  
current  
t
short-circuit over the load  
V
9
10 ms  
V
P
t
50 µs  
Fig.5 Short-circuit waveform.  
2002 Mar 05  
6
 
Philips Semiconductors  
Product specification  
4 × 40 W BTL quad car radio power  
amplifier  
TDA8571J  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
SYMBOL  
VP  
PARAMETER  
supply voltage  
CONDITIONS  
operating  
MIN.  
MAX.  
UNIT  
18  
30  
45  
V
V
V
non-operating  
load dump protection;  
during 50 ms; tr 2.5 ms  
Vsc(safe)  
Vrp  
short-circuit safe voltage  
reverse polarity voltage  
non-repetitive peak output current  
repetitive peak output current  
total power dissipation  
55  
40  
18  
6
V
V
IOSM  
IORM  
Ptot  
10  
A
7.5  
A
60  
W
°C  
°C  
°C  
Tstg  
storage temperature  
+150  
+85  
150  
Tamb  
Tvj  
ambient temperature  
virtual junction temperature  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
VALUE  
UNIT  
Rth j-a  
Rth j-c  
thermal resistance from junction to ambient in free air  
thermal resistance from junction to case (see Fig.6)  
40  
1
K/W  
K/W  
virtual junction  
OUT2 OUT3  
handbook, halfpage  
OUT1  
OUT4  
3.2 K/W  
3.2 K/W  
3.2 K/W  
3.2 K/W  
0.2 K/W  
case  
MGG157  
Fig.6 Equivalent thermal resistance network.  
2002 Mar 05  
7
 
Philips Semiconductors  
Product specification  
4 × 40 W BTL quad car radio power  
amplifier  
TDA8571J  
QUALITY SPECIFICATION  
In accordance with “General Quality Specification For Integrated Circuits (SNW-FQ-611D)”.  
DC CHARACTERISTICS  
VP = 14.4 V; Tamb = 25 °C; measured in Fig.7; unless otherwise specified.  
SYMBOL  
Supply  
PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
VP  
supply voltage  
quiescent current  
note 1  
6
14.4  
200  
18  
V
Iq(tot)  
RL = ∞  
360  
mA  
Operating condition  
VMODE  
IMODE  
VO  
mode select switch level  
8.5  
30  
7.0  
Vp  
80  
V
mode select switch current  
output voltage  
VMODE = 14.4 V  
note 2  
µA  
V
Mute condition  
VMODE  
VO  
mode select switch level  
output voltage  
3.3  
7.0  
6.4  
80  
80  
V
note 2  
V
VOS  
DC output offset voltage  
delta DC output offset voltage  
MUTE  
mV  
mV  
VOS  
ON MUTE  
Standby condition  
VMODE mode select switch level  
Istb  
0
0.2  
2
V
standby current  
100  
µA  
Diagnostic  
VDIAG  
Tvj  
diagnostic output voltage  
temperature pre-warning  
during any fault condition  
VDIAG = 0.6 V  
145  
0.6  
V
°C  
Notes  
1. The circuit is DC adjusted at VP = 6 to 18 V and AC operating at VP = 8.5 to 18 V.  
2. At 18 V < VP < 30 V the DC output voltage 12VP.  
2002 Mar 05  
8
 
Philips Semiconductors  
Product specification  
4 × 40 W BTL quad car radio power  
amplifier  
TDA8571J  
AC CHARACTERISTICS  
VP = 14.4 V; RL = 4 ; f = 1 kHz; Tamb = 25 °C; measured in Fig.7; unless otherwise specified.  
SYMBOL  
Po  
PARAMETER  
output power  
CONDITIONS  
THD = 0.5%  
MIN.  
16  
TYP.  
19  
MAX.  
UNIT  
W
THD = 10%  
21  
26  
W
W
W
W
VP = 13.7 V; THD = 0.5%  
VP = 13.7 V; THD = 10%  
17.5  
23  
Po(EIAJ)  
Po(max)  
THD  
EIAJ output power  
THD = maximum;Vi = 2 V (p-p) 35  
square wave  
40  
maximum output power  
total harmonic distortion  
THD = maximum; VP = 15.2 V; 40  
Vi = 2 V (p-p) square wave  
45  
W
Po = 1 W  
0.1  
10  
%
VMODE = 0.6 V; note 1  
%
Bp  
power bandwidth  
THD = 0.5%; Po = 1 dB with  
20 to  
20000  
Hz  
respect to 16 W  
fro(l)  
low frequency roll-off  
high frequency roll-off  
closed-loop voltage gain  
at 1 dB; note 2  
at 1 dB  
20  
33  
25  
Hz  
fro(h)  
kHz  
dB  
Gv(cl)  
SVRR  
34  
35  
supply voltage ripple rejection Rs = 0 ; maximum ripple  
Vripple = 2 V (p-p)  
on  
40  
50  
80  
25  
30  
38  
dB  
dB  
dB  
kΩ  
mute  
standby  
Zi  
input impedance  
Vn(o)  
noise output voltage  
B = 20 Hz to 20 kHz  
on; Rs = 0 Ω  
45  
125  
150  
100  
170  
1
µV  
µV  
µV  
dB  
dB  
mV  
on; Rs = 10 kΩ  
mute; independent of Rs  
Po = 16 W; Rs = 10 kΩ  
αcs  
Gv  
Vo  
channel separation  
channel unbalance  
output signal in mute  
maximum input voltage  
Vi = 1 V (RMS)  
2
Notes  
1. Dynamic Distortion Detector (DDD) active, pin VDIAG is set to LOW level.  
2. Frequency response externally fixed.  
2002 Mar 05  
9
 
Philips Semiconductors  
Product specification  
4 × 40 W BTL quad car radio power  
amplifier  
TDA8571J  
TEST AND APPLICATION INFORMATION  
V
MODE  
P
+14.4 V  
2200 µF  
100 nF  
V
1
V
8
V
V
P1  
P2  
P3  
16  
P4  
23  
15  
10  
IN1  
input 1  
input 2  
input 3  
input 4  
+
2
4
OUT1+  
470 nF  
30 kΩ  
R
L
= 4 Ω  
+
OUT1−  
V
ref  
11  
IN2  
+
7
OUT2+  
470 nF  
30 kΩ  
R
= 4 Ω  
L
+
OUT2−  
5
9
10 kΩ  
+V  
P
12  
13  
SGND  
IN3  
V
DIAG  
diagnostic  
output  
TDA8571J  
DIAGNOSTIC  
+
17  
OUT3+  
470 nF  
30 kΩ  
R
L
= 4 Ω  
+
OUT3−  
19  
V
ref  
14  
IN4  
+
22  
20  
OUT4+  
470 nF  
30 kΩ  
R
L
= 4 Ω  
+
OUT4−  
3
6
18  
21  
PGND1 PGND2 PGND3 PGND4  
MGM564  
power ground (substrate)  
Special care must be taken in the PCB-layout to separate pin VDIAG from the pins IN1, IN2, IN3 and IN4 to minimize the crosstalk between the clip output  
and the inputs.  
To avoid switch-on plops, it is advised to keep the amplifier in the mute mode during a period of 150 ms (charging the input capacitors at pins IN1,  
IN2, IN3 and IN4).  
Fig.7 Application circuit diagram.  
2002 Mar 05  
10  
 
Philips Semiconductors  
Product specification  
4 × 40 W BTL quad car radio power  
amplifier  
TDA8571J  
Test information  
Figures 8 to 13 have the following conditions: VP = 14.4 V; RL = 4 ; f = 1 kHz; 80 kHz filter used; unless otherwise  
specified.  
MGM567  
MGM566  
80  
300  
handbook, halfpage  
handbook, halfpage  
P
o
(W)  
I
P
(mA)  
60  
200  
40  
20  
(1)  
100  
(2)  
(3)  
0
8
0
0
10  
12  
14  
16  
18  
4
8
12  
16  
20  
V
(V)  
V
(V)  
P
P
(1) EIAJ; 100 Hz.  
(2) THD + N = 10%.  
(3) THD + N = 0.5%.  
Fig.8 IP as a function of VP.  
Fig.9 Po as a function of VP.  
MGM568  
MGM569  
10  
10  
handbook, halfpage  
handbook, halfpage  
THD + N  
(%)  
THD + N  
(%)  
1
1
(1)  
(2)  
(1)  
1  
10  
1  
10  
(2)  
(3)  
2  
10  
2  
10  
2  
1  
2
10  
10  
1
10  
10  
2
3
4
5
10  
10  
10  
10  
10  
P
(W)  
f (Hz)  
o
(1) f = 10 kHz.  
(2) f = 1 kHz.  
(3) f = 100 Hz.  
(1) Po = 1 W.  
(2) Po = 10 W.  
Fig.10 THD + N as a function of Po.  
Fig.11 THD + N as a function of frequency.  
2002 Mar 05  
11  
 
Philips Semiconductors  
Product specification  
4 × 40 W BTL quad car radio power  
amplifier  
TDA8571J  
MGM570  
MGM565  
20  
30  
handbook, halfpage  
handbook, halfpage  
α
(dB)  
cs  
SVRR  
(dB)  
(1)  
40  
50  
(2)  
60  
70  
90  
80  
2
3
4
5
2
3
4
5
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
f (Hz)  
f (Hz)  
(1) Between channels 1 and 2 or between channels 3 and 4.  
(2) Between channels 1 or 2 and channels 3 or 4.  
Fig.13 Channel separation as a function of  
frequency.  
Fig.12 SVRR as a function of frequency.  
2002 Mar 05  
12  
 
Philips Semiconductors  
Product specification  
4 × 40 W BTL quad car radio power  
amplifier  
TDA8571J  
PCB layout  
111.76  
78.74  
Pgnd  
100 nF  
2200 µF  
V
P
out 4  
out1  
+
+
470 nF  
470 nF  
out 3  
+
out2  
+
diag  
in  
sgnd  
in  
mode  
10 kΩ  
1
2
3
4
MGK079  
Dimensions in mm.  
Fig.14 PCB layout (component side).  
13  
2002 Mar 05  
 
Philips Semiconductors  
Product specification  
4 × 40 W BTL quad car radio power  
amplifier  
TDA8571J  
111.76  
78.74  
Pgnd  
100nF  
2200 µF  
V
P
out 4  
out1  
+
+
470 nF  
470 nF  
out 3  
+
out2  
+
mode  
in  
sgnd  
in  
diag  
10 kΩ  
4
3
2
1
MGK080  
Dimensions in mm.  
Fig.15 PCB layout (soldering side).  
14  
2002 Mar 05  
 
Philips Semiconductors  
Product specification  
4 × 40 W BTL quad car radio power  
amplifier  
TDA8571J  
PACKAGE OUTLINE  
DBS23P: plastic DIL-bent-SIL power package; 23 leads (straight lead length 3.2 mm)  
SOT411-1  
non-concave  
D
h
x
D
E
h
view B: mounting base side  
A
2
d
A
A
5
4
β
E
2
B
j
E
E
1
L
2
L
L
3
1
L
c
2
Q
v
M
1
23  
e
m
e
w
M
1
Z
b
p
e
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
(1)  
(1)  
UNIT A  
A
A
b
c
D
d
D
E
e
e
e
E
E
E
j
L
L
L
L
3
m
Q
v
w
x
β
Z
2
4
5
p
h
1
2
h
1
2
1
2
4.6 1.15 1.65 0.75 0.55 30.4 28.0  
4.3 0.85 1.35 0.60 0.35 29.9 27.5  
12.2  
11.8  
10.15 6.2 1.85 3.6 14.0 10.7 2.4  
9.85 5.8 1.65 2.8 13.0 9.9 1.6  
1.43  
0.78  
2.1  
1.8  
6
mm  
12  
2.54 1.27 5.08  
4.3  
0.6 0.25 0.03 45°  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
96-10-11  
98-02-20  
SOT411-1  
2002 Mar 05  
15  
 
Philips Semiconductors  
Product specification  
4 × 40 W BTL quad car radio power  
amplifier  
TDA8571J  
SOLDERING  
The total contact time of successive solder waves must not  
exceed 5 seconds.  
Introduction to soldering through-hole mount  
packages  
The device may be mounted up to the seating plane, but  
the temperature of the plastic body must not exceed the  
specified maximum storage temperature (Tstg(max)). If the  
printed-circuit board has been pre-heated, forced cooling  
may be necessary immediately after soldering to keep the  
temperature within the permissible limit.  
This text gives a brief insight to wave, dip and manual  
soldering. A more in-depth account of soldering ICs can be  
found in our “Data Handbook IC26; Integrated Circuit  
Packages” (document order number 9398 652 90011).  
Wave soldering is the preferred method for mounting of  
through-hole mount IC packages on a printed-circuit  
board.  
Manual soldering  
Apply the soldering iron (24 V or less) to the lead(s) of the  
package, either below the seating plane or not more than  
2 mm above it. If the temperature of the soldering iron bit  
is less than 300 °C it may remain in contact for up to  
10 seconds. If the bit temperature is between  
Soldering by dipping or by solder wave  
The maximum permissible temperature of the solder is  
260 °C; solder at this temperature must not be in contact  
with the joints for more than 5 seconds.  
300 and 400 °C, contact may be up to 5 seconds.  
Suitability of through-hole mount IC packages for dipping and wave soldering methods  
SOLDERING METHOD  
PACKAGE  
DIPPING  
WAVE  
DBS, DIP, HDIP, SDIP, SIL  
suitable  
suitable(1)  
Note  
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.  
2002 Mar 05  
16  
 
Philips Semiconductors  
Product specification  
4 × 40 W BTL quad car radio power  
amplifier  
TDA8571J  
DATA SHEET STATUS  
PRODUCT  
DATA SHEET STATUS(1)  
STATUS(2)  
DEFINITIONS  
Objective data  
Development This data sheet contains data from the objective specification for product  
development. Philips Semiconductors reserves the right to change the  
specification in any manner without notice.  
Preliminary data  
Qualification  
This data sheet contains data from the preliminary specification.  
Supplementary data will be published at a later date. Philips  
Semiconductors reserves the right to change the specification without  
notice, in order to improve the design and supply the best possible  
product.  
Product data  
Production  
This data sheet contains data from the product specification. Philips  
Semiconductors reserves the right to make changes at any time in order  
to improve the design, manufacturing and supply. Changes will be  
communicated according to the Customer Product/Process Change  
Notification (CPCN) procedure SNW-SQ-650A.  
Notes  
1. Please consult the most recently issued data sheet before initiating or completing a design.  
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was  
DEFINITIONS  
DISCLAIMERS  
Short-form specification  
The data in a short-form  
Life support applications  
These products are not  
specification is extracted from a full data sheet with the  
same type number and title. For detailed information see  
the relevant data sheet or data handbook.  
designed for use in life support appliances, devices, or  
systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips  
Semiconductors customers using or selling these products  
for use in such applications do so at their own risk and  
agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition Limiting values given are in  
accordance with the Absolute Maximum Rating System  
(IEC 60134). Stress above one or more of the limiting  
values may cause permanent damage to the device.  
These are stress ratings only and operation of the device  
at these or at any other conditions above those given in the  
Characteristics sections of the specification is not implied.  
Exposure to limiting values for extended periods may  
affect device reliability.  
Right to make changes  
Philips Semiconductors  
reserves the right to make changes, without notice, in the  
products, including circuits, standard cells, and/or  
software, described or contained herein in order to  
improve design and/or performance. Philips  
Semiconductors assumes no responsibility or liability for  
the use of any of these products, conveys no licence or title  
under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that  
these products are free from patent, copyright, or mask  
work right infringement, unless otherwise specified.  
Application information  
Applications that are  
described herein for any of these products are for  
illustrative purposes only. Philips Semiconductors make  
no representation or warranty that such applications will be  
suitable for the specified use without further testing or  
modification.  
2002 Mar 05  
17  
 
Philips Semiconductors  
Product specification  
4 × 40 W BTL quad car radio power  
amplifier  
TDA8571J  
NOTES  
2002 Mar 05  
18  
 
Philips Semiconductors  
Product specification  
4 × 40 W BTL quad car radio power  
amplifier  
TDA8571J  
NOTES  
2002 Mar 05  
19  
 
Philips Semiconductors – a worldwide company  
Contact information  
For additional information please visit http://www.semiconductors.philips.com.  
Fax: +31 40 27 24825  
For sales offices addresses send e-mail to: [email protected].  
© Koninklijke Philips Electronics N.V. 2002  
SCA74  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
753503/02/pp20  
Date of release: 2002 Mar 05  
Document order number: 9397 750 09411  
 

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